High-Precision Explosion-Proof Platform Scales: Empowering Korean Semiconductor Partners to Break Through Production Constraints

A high-cleanliness workshop environment demands scale surfaces without pores or grooves, resistant to frequent cleaning, and free from particle contamination of wafers, imposing special requirements on equipment materials and structural design.

III. Microtess Custom Solutions: Accurately Solving Problems

(1) Precision and Structural Optimization: Building a “Precise” Foundation

• Sensor and Algorithm Synergy: Utilizes high-precision strain gauge sensors with customized instruments for excellent resolution. Incorporates a built-in air pressure compensation module to counter micro-environmental fluctuations, ensuring stable and accurate readings for reliable weighing of chip components.
• Mechanical Structure Enhancement: Adds shock-absorbing buffers to the scale base to absorb high-frequency vibrations (vibration transmission rate < 1%). The housing is integrally formed from 316L stainless steel with electrochemical polishing (Ra < 0.8μm), enhancing corrosion resistance and reducing particle adhesion, establishing a dual-dimensional precision guarantee system.

(2) Explosion-Proof and Material Innovation: Building a Safety Barrier

• Explosion-Proof Design: The 316L stainless steel housing is laser-welded and sealed to IP66, filled with inert gas (nitrogen) to isolate flammable gases from circuits. Uses intrinsically safe circuits (Ex ia IIC T4) with explosion-proof certified components, ensuring no sparks and preventing internal faults from causing explosions.
• Corrosion Resistance Upgrade: The scale platform and sensor housing use PTFE coating (0.2 – 0.5mm thick) via plasma spraying, withstanding strong acids and alkalis. Accelerated life tests show a wear rate < 5%, extending equipment life by 3 times compared to traditional solutions.

(3) Space Customization Design: “Flexible Integration” for Compact Production Lines

• Precise Size Reduction: Strictly following the production line layout, the scale dimensions are compressed to 30cm (W) × 25cm (D) × 11cm (H), with M6 threaded positioning holes for robotic arm integration. Supports SMEMA protocol for seamless automation, eliminating manual intervention.
• Installation Without Modification: Modular quick-install design fits directly into pre-reserved slots, completing mechanical installation and circuit debugging within 2 hours without altering existing production lines, enabling “plug-and-play.”

(4) Cleanliness and Compliance Details: Meeting Cleanroom Standards

1. No-Dead-Corner Clean Structure: Laser welding and rounded transitions eliminate dust traps, ensuring easy cleaning with cleanroom mops. Cables use anti-fall connectors and PFA hoses for low volatility and corrosion resistance.

Low Volatility and Anti-Static Properties: All non-metallic parts meet SEMI C12 certification, ensuring VOC emissions < 0.05mg/m³ under high-temperature cleaning. The housing features anti-static treatment (surface resistance 10^7 Ω), preventing particle adhesion and ESD damage to chips.

IV. Implementation Results: A “Practical” Witness to Production Line Renewal

(1) Precision Drives Yield Improvement: From “Trial-and-Error” to “Precision”

After deployment, the weighing error of chip components reduced from ±0.5mg to ±0.03mg, improving packaging yield by 2.3%. In a production batch of 100,000 chips, it directly reduced 2,300 defective reworks, saving approximately $120,000 (including materials, labor, and testing costs).

Real-time data upload via MES enables “defective product tracing,” reducing problem time from 4 hours to 30 minutes.

(2) Efficiency Drives Production Speed: From “Bottlenecks” to “Smooth Flow”

The compact design integrates seamlessly into the production line, reducing the weighing time per batch (500 chip components) from 8 minutes to 3 minutes, increasing daily throughput by 167% (from 1,200 to 3,200 units).

Robotic arm operators report: “The equipment now runs continuously for 8 hours, increasing ‘lights-out production’ from 30% to 70%, significantly improving efficiency.”

(3) Safety Ensures Stable Production: From “Hazards” to “Peace of Mind”

With explosion-proof and corrosion-resistant designs, the scales eliminate risks of chemical leaks and gas explosions (passing the Korean KCs safety audit). In accidental hydrofluoric acid leakage tests, the PTFE coating effectively resists corrosion, ensuring stable operation.

Customer Production Director’s Comment:
“Microtess’s customized solution redefines our understanding of ‘industrial scales’—it’s not just a weighing tool but a link connecting precision, efficiency, and safety. Every detail reflects a deep understanding of semiconductor manufacturing, solving current problems and preparing for future 3nm packaging processes.”

V. About Microtess: Customization Expert in Semiconductor Deep Cultivation

In the semiconductor precision manufacturing field, Microtess understands that “standards” cannot meet “precise” needs. We use “scenario deconstruction + technological innovation + compliance implementation” to create customized solutions:

• Whether your semiconductor production line faces cleanroom adaptation, explosion-proof compliance, or micro-precision weighing challenges, Microtess provides tailored solutions.
• Contact us now and let Microtess be your production problem solver, defining new possibilities in semiconductor manufacturing with customized precision.
• Scenario Deconstruction: Deeply analyze production line layouts, airflows, and operational habits to ensure solutions fit real needs.
• Technological Innovation: Integrate sensor miniaturization, explosion-proof materials, and intelligent algorithms to break performance boundaries.
• Compliance Implementation: Adhere to international standards (SEMI, ATEX, IECEx) to avoid market access risks.

Whether your semiconductor production line faces cleanroom adaptation, explosion-proof compliance, or micro-precision weighing challenges, Microtess provides tailored solutions.